Koch-Chemie Polish & Sealing Pad

Extra-fine finish sponge for economically and evenly applying sealant or wax.

The short height of 23mm creates low torsion forces, excellent handling and the highest level of stability.

The optimised reticulation (open cellular structure) and cell count contribute to excellent hygiene factors.

The milling edge ensures extra flexibility for the pads, enabling them to fit around contours easier.

The colourful non-woven material, suitable for polishing, ensures process safety.

Compression hardness: 4. Abrasiveness: 2.